Uwukhetha njani uMphezulu wokuGqibela kuYilo lwePCB yakho
Ⅱ UVavanyo kunye nothelekiso
ithunyelwe: NgoNovemba 16, 2022
Iindidi: Iiblogi
Iithegi: pcb,pcba,indibano yepcb,ukwenziwa kwepcb, pcb umphezulu ukugqiba
Kukho iingcebiso ezininzi malunga nokugqitywa komphezulu, njenge-HASL engenalo i-lead inengxaki yokuba ne-flatness engaguqukiyo.I-Electrolytic Ni/Au ibiza kakhulu kwaye ukuba igolide eninzi ifakwe kwi-pad, inokukhokelela kwi-brittle joints solder.Itoti yokuntywiliselwa inokonakala kwe-solderability emva kokuvezwa kwimijikelo yobushushu emininzi, njengakwicala eliphezulu nelisezantsi inkqubo yePCBA yokuqukuqela kwakhona, njl. njlLe theyibhile ingezantsi ibonisa uvandlakanyo olurhabaxa lokugqitywa komphezulu osoloko usetyenziswa kwiibhodi zesekethe eziprintiweyo.
Itheyibhile1 Inkcazo emfutshane yenkqubo yokwenziwa kwemveliso, izinto eziluncedo nezingalunganga, kunye nosetyenziso oluqhelekileyo lokugqitywa komphezulu okungekho lead kwePCB.
| PCB Surface Gqiba | Inkqubo | Ukutyeba | Iingenelo | Iingxaki | Usetyenziso oluqhelekileyo |
| I-HASL yasimahla | Iibhodi zePCB zintywiliselwa kwibhafu yetoti etyhidiweyo kwaye emva koko yavuthelwa ziimela ezishushu zomoya oshushu kunye nokususa i-solder engaphezulu. | 30µin(1µm) -1500µin(40µm) | Ukuthengiselana okulungileyo;Ifumaneka ngokubanzi;Inokulungiswa / isetyenzwe kwakhona;Ishelufu ende ubude | Imiphezulu engalinganiyo;Umothuko wobushushu;Ukumanzisa kakubi;Ibhulorho yeSolder;PTHs eziplagiweyo. | Isebenza ngokubanzi;Ilungele iipads ezinkulu kunye nesithuba;Ayifanelekanga kwi-HDI ene-<20 mil (0.5mm) i-pitch entle kunye ne-BGA;Ayilunganga kwi-PTH;Ayifanelanga iPCB yobhedu eshinyeneyo;Ngokuqhelekileyo, isicelo: Iibhodi zeesekethe zokuvavanya umbane, ukuthengiswa kwezandla, ezinye izinto zombane ezisebenza kakhulu ezifana ne-aerospace kunye nezixhobo zomkhosi. |
| OSP | Ukusetyenziswa ngokwekhemikhali kwikhompawundi ephilayo kwiibhodi zomphezulu zenza umaleko we-organic metallic ukukhusela ubhedu oluvelileyo kumhlwa. | 46µin (1.15µm) -52µin(1.3µm) | Ixabiso eliphantsi;Iipads zifana kwaye zisicaba;I-solderability elungileyo;Inokuba yiyunithi kunye nezinye iziqendu ezingaphezulu;Inkqubo ilula;Ingaphinda isetyenzwe (ngaphakathi kwiworkshop). | Inovakalelo ekuphatheni;Ubomi obufutshane beshelufu.Ukusasazeka kwe-solder encinci kakhulu;Solderability ukuthotywa kunye temp ephakanyisiweyo & imijikelo;Nonconductive;Kunzima ukuyihlola, i-ICT probe, ionic & ne-press-fit inkxalabo | Isebenza ngokubanzi;Ifaneleke kakuhle kwi-SMT/i-fine pitches/BGA/amalungu amancinane;Ukukhonza iibhodi;Ayilunganga kwii-PTHs;Ayifanelanga itekhnoloji yecrimping |
| ENIG | Inkqubo yeMichiza ecoca ubhedu oluveziweyo nge-Nickel kunye neGolide, ngoko ke luqulathe umaleko ophindwe kabini wesinyithi. | 2µin (0.05µm)– 5µin (0.125µm) yeGolide ngaphezu kwe-120µin (3µm)– 240µin (6µm) yeNickel | I-solderability egqwesileyo;Iipads zisicaba kwaye zifana;Al wire bendability;Ukuchasana koqhagamshelwano oluphantsi;Ubomi bethala elide;Ukuxhathisa okulungileyo kokubola kunye nokuqina | inkxalabo "yeBlack Pad";Ilahleko yomqondiso kwizicelo zemfezeko yomqondiso;ayikwazi ukusebenza kwakhona | Igqwesile kwiNdibano yepitch entle kunye nokubekwa komphezulu ombaxa (BGA, QFP…);Igqwesileyo kwiintlobo ezininzi zeSoldering;Ekhethwayo kwi-PTH, cinezela kufanelekile;ukuBonda ngocingo;Cebisa kwi-PCB ngesicelo sokuthembeka okuphezulu okufana ne-aerospace, umkhosi, abathengi bezonyango kunye nabaphezulu, njl.;Ayikhuthazwa kwiiPads zoQhagamshelwano leTouch. |
| Electrolytic Ni/Au (Igolide ethambileyo) | I-99.99% ecocekileyo - i-24 carat Gold isetyenziswe phezu kwe-nickel layer ngokusebenzisa inkqubo ye-electrolytic phambi kwe-soldermask. | 99.99% Igolide esulungekileyo, 24 Karat 30µin (0.8µm) -50µin (1.3µm) ngaphezulu kwe-100µin (2.5µm) -200µin (5µm) yeNickel | Umphezulu oqinileyo, oqinileyo;I-conductivity enkulu;Ukucaba;Al wire bendability;Ukuchasana koqhagamshelwano oluphantsi;Ubomi beshelufa ende | Iyabiza;Au embrittlement ukuba ngqindilili kakhulu;Imiqobo yokwakheka;Ukulungiswa okongeziweyo/umsebenzi onzima;Ayilungelelanisi i-solder;Ukwaleka akufani | Isetyenziswa kakhulu kwintambo (i-Al & Au) yokudibanisa kwi-chip package efana ne-COB (i-Chip kwiBhodi) |
| Electrolytic Ni/Au (Igolide eHard) | I-98% ecocekileyo - i-23 carat yeGolide eneziqinisekiso zongezwa kwisitya sokuhlambela esifakwe kwi-nickel layer ngokusebenzisa inkqubo ye-electrolytic. | 98% Igolide esulungekileyo, 23 Karat30µin(0.8µm) -50µin(1.3µm) ngaphezulu kwe100µin(2.5µm) -150µin(4µm) yeNickel | I-solderability egqwesileyo;Iipads zisicaba kwaye zifana;Al wire bendability;Ukuchasana koqhagamshelwano oluphantsi;Inokuphinda isebenze | Ukungcolisa (ukuphatha kunye nokugcinwa) umhlwa kwindawo ephezulu yesalfure;Iinketho ezincitshisiweyo zekhonkco lokubonelela ukuxhasa oku kugqitywa;Ifestile emfutshane yokusebenza phakathi kwezigaba zendibano. | Ikakhulu isetyenziselwa uqhagamshelo lombane olufana nezihlanganisi edge (umnwe wegolide), iibhodi ze-IC carrier (PBGA/FCBGA/FCCSP...) , Keyboards, abafowunelwa bebhetri kunye nezinye iipads zovavanyo, njl. |
| Ukuntywiliselwa Ag | Umaleko weSilivere ufakwa kumphezulu wobhedu ngenkqubo yokucwenga i-electroless emva kwe-etch kodwa ngaphambi kwe-soldermask. | 5µin(0.12µm) -20µin(0.5µm) | I-solderability egqwesileyo;Iipads zisicaba kwaye zifana;Al wire bendability;Ukuchasana koqhagamshelwano oluphantsi;Inokuphinda isebenze | Ukungcolisa (ukuphatha kunye nokugcinwa) umhlwa kwindawo ephezulu yesalfure;Iinketho ezincitshisiweyo zekhonkco lokubonelela ukuxhasa oku kugqitywa;Ifestile emfutshane yokusebenza phakathi kwezigaba zendibano. | Enye indlela yezoqoqosho kwi-ENIG yeFine Traces kunye ne-BGA;Ilungele ukusetyenziswa kweempawu zesantya esiphezulu;Ilungele ukutshintshwa kwe-membrane, i-EMI yokukhusela, kunye ne-aluminium edibeneyo yocingo;Ifanele ipress fit. |
| Ukuntywiliselwa Sn | Kwibhafu yeekhemikhali ezingenayo i-electroless, umaleko omhlophe obhityileyo weTin ubeka ngokuthe ngqo kubhedu lweebhodi zeesekethe njengomqobo wokuthintela i-oxidation. | 25µin (0.7µm) -60µin(1.5µm) | Eyona nto ingcono kwitekhnoloji yokushicilela;Isebenza kakuhle emalini;I-Planar;I-solderability egqwesileyo (xa intsha) kunye nokuthembeka;Ukucaba | Solderability ukuthotywa nge temps ephakamileyo & imijikelo;Itoti eveziweyo kwindibano yokugqibela inokonakala;Ukusingatha imiba;iTin Wiskering;Ayifanelanga i-PTH;Iqulethe i-Thiourea, iCarcinogen eyaziwayo. | Ukucebisa ngemveliso yesixa esikhulu;Ilungele ukubekwa kwe-SMD, i-BGA;Eyona nto ilungele ucofa kunye neenqwelomoya;Ayikhuthazwa kwi-PTH, utshintshiselwano loqhagamshelwano, kunye nokusetyenziswa kweemaski ezi peelable |
Uluhlu2 Uvavanyo lweepropathi eziqhelekileyo zePCB Surface yale mihla yokuGqibela kwimveliso kunye nokusetyenziswa
| Ukuveliswa kwezinto eziqhelekileyo ezisetyenziswayo ezigqityiweyo | |||||||||
| Iipropati | ENIG | ENEPIG | Igolide ethambileyo | Igolide elukhuni | IAg | ISn | I-HASL | HASL- LF | OSP |
| Ukuduma | Phezulu | Phantsi | Phantsi | Phantsi | Phakathi | Phantsi | Phantsi | Phezulu | Phakathi |
| Iindleko zeNkqubo | Phezulu (1.3x) | Phezulu (2.5x) | Ephezulu (3.5x) | Ephezulu (3.5x) | Phakathi (1.1x) | Phakathi (1.1x) | Phantsi (1.0x) | Phantsi (1.0x) | Elona lisezantsi (0.8x) |
| Idiphozithi | Ukuntywiliselwa | Ukuntywiliselwa | Electrolytic | Electrolytic | Ukuntywiliselwa | Ukuntywiliselwa | Ukuntywiliselwa | Ukuntywiliselwa | Ukuntywiliselwa |
| Beka ubomi kwishelufa | Inde | Inde | Inde | Inde | Phakathi | Phakathi | Inde | Inde | Mfutshane |
| I-RoHS iyahambelana | Ewe | Ewe | Ewe | Ewe | Ewe | Ewe | No | Ewe | Ewe |
| I-Surface Co-planarity ye-SMT | Egqwesileyo | Egqwesileyo | Egqwesileyo | Egqwesileyo | Egqwesileyo | Egqwesileyo | Ubuhlwempu | Kulungile | Egqwesileyo |
| Ubhedu oluveziweyo | No | No | No | Ewe | No | No | No | No | Ewe |
| Ukuphatha | Okuqhelekileyo | Okuqhelekileyo | Okuqhelekileyo | Okuqhelekileyo | Okubalulekileyo | Okubalulekileyo | Okuqhelekileyo | Okuqhelekileyo | Okubalulekileyo |
| Inkqubo Inzame | Phakathi | Phakathi | Phezulu | Phezulu | Phakathi | Phakathi | Phakathi | Phakathi | Phantsi |
| Amandla okusebenza kwakhona | No | No | No | No | Ewe | Akucetyiswa | Ewe | Ewe | Ewe |
| Imijikelezo yeThermal efunekayo | ezininzi | ezininzi | ezininzi | ezininzi | ezininzi | 2-3 | ezininzi | ezininzi | 2 |
| Umba weWhisk | No | No | No | No | No | Ewe | No | No | No |
| Thermal Shock (PCB MFG) | Phantsi | Phantsi | Phantsi | Phantsi | Isezantsi kakhulu | Isezantsi kakhulu | Phezulu | Phezulu | Isezantsi kakhulu |
| Ukumelana okuphantsi / isantya esiphezulu | No | No | No | No | Ewe | No | No | No | N / A |
| Usetyenziso lwezona zinto zixhaphakileyo zokugqiba umphezulu osetyenziswayo | |||||||||
| Usetyenziso | ENIG | ENEPIG | Igolide ethambileyo | Igolide Elukhuni | IAg | ISn | I-HASL | I-LF-HASL | OSP |
| Uqinile | Ewe | Ewe | Ewe | Ewe | Ewe | Ewe | Ewe | Ewe | Ewe |
| Flex | Ithintelwe | Ithintelwe | Ewe | Ewe | Ewe | Ewe | Ewe | Ewe | Ewe |
| I-Flex-Rigid | Ewe | Ewe | Ewe | Ewe | Ewe | Ewe | Ewe | Ewe | Ayikhethwanga |
| I-Pitch entle | Ewe | Ewe | Ewe | Ewe | Ewe | Ewe | Ayikhethwanga | Ayikhethwanga | Ewe |
| I-BGA & μBGA | Ewe | Ewe | Ewe | Ewe | Ewe | Ewe | Ayikhethwanga | Ayikhethwanga | Ewe |
| Ukuthengiswa okuninzi | Ewe | Ewe | Ewe | Ewe | Ewe | Ewe | Ewe | Ewe | Ithintelwe |
| Flip Chip | Ewe | Ewe | Ewe | Ewe | Ewe | Ewe | No | No | Ewe |
| Cofa iFit | Ithintelwe | Ithintelwe | Ithintelwe | Ithintelwe | Ewe | Egqwesileyo | Ewe | Ewe | Ithintelwe |
| Nge-Hole | Ewe | Ewe | Ewe | Ewe | Ewe | No | No | No | No |
| Ukudibanisa ucingo | Ewe (Al) | Ewe (Al, Au) | Ewe (Al, Au) | Ewe (Al) | Iyaguquguquka (Al) | No | No | No | Ewe (Al) |
| Ukumanzisa kweSolder | Kulungile | Kulungile | Kulungile | Kulungile | Kakuhle kakhulu | Kulungile | Ubuhlwempu | Ubuhlwempu | Kulungile |
| I-Solder Joint Integrity | Kulungile | Kulungile | Ubuhlwempu | Ubuhlwempu | Egqwesileyo | Kulungile | Kulungile | Kulungile | Kulungile |
Ubomi beshelufu yinto ebalulekileyo ekufuneka uyiqwalasele xa usenza iishedyuli zakho zokuvelisa.Beka ubomi kwishelufayifestile yokusebenza enika ukugqiba ukuba ne-PCB yeldability epheleleyo.Kubalulekile ukuqiniseka ukuba zonke ii-PCB zakho zidityanisiwe kubomi beshelufu.Ukongeza kwizinto kunye nenkqubo eyenza ukugqitywa komphezulu, ubomi beshelufu bokugqiba buphenjelelwa kakhulungePCBs ukupakishwa kunye nokugcinwa.Umfaki-sicelo ongqongqo wendlela yogcino eyiyo ecetyiswe yi-IPC-1601 izikhokelo ziya kugcina ukugqiba ukuwelda kunye nokuthembeka.
ULuhlu 3 kubomi beShelufu uthelekiso phakathi kokuGqibela uMphezulu odumileyo wePCB
|
| UBOMI be-SHEL obuqhelekileyo | Ubomi beShelufu obuCetyisiweyo | Rework Chance |
| I-HASL-LF | Iinyanga ezili-12 | Iinyanga ezili-12 | EWE |
| OSP | Iinyanga ezi-3 | Iinyanga ezi-1 | EWE |
| ENIG | Iinyanga ezili-12 | Iinyanga ezi-6 | HAYI* |
| ENEPIG | Iinyanga ezi-6 | Iinyanga ezi-6 | HAYI* |
| Electrolytic Ni/Au | Iinyanga ezili-12 | Iinyanga ezili-12 | NO |
| IAg | Iinyanga ezi-6 | Iinyanga ezi-3 | EWE |
| ISn | Iinyanga ezi-6 | Iinyanga ezi-3 | EWE** |
* I-ENIG kunye ne-ENEPIG ukugqiba umjikelo wokuvuselela ukuphucula ukumanzi komphezulu kunye nobomi beshelufu buyafumaneka.
** Ukuphinda kusetyenzwe kwakhona kweMichiza yeTin akucetyiswanga.
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Ixesha lokuposa: Nov-16-2022
