Ukwenziwa kwe-HDI PCB ---Ukuntywiliselwa kunyango lomphezulu weGolide
ithunyelwe:NgoJanuwari 28, 2023
Iindidi: Iiblogi
Iithegi: pcb,pcba,indibano yepcb,ukwenziwa kwepcb, pcb umphezulu ukugqiba
I-ENIG ibhekisa kwi-Electroless Nickel / Imersion Gold, ekwabizwa ngokuba yikhemikhali i-Ni/Au, ukusetyenziswa kwayo kuye kwaduma ngoku ngenxa yoxanduva lokuphendula kwimithetho engahlawulelwayo kunye nokufaneleka kwayo kwindlela yoyilo yePCB yangoku ye-HDI kunye neepitches ezilungileyo phakathi kwe-BGAs kunye nee-SMTs. .
I-ENIG yinkqubo yeMichiza ebeka iipleyiti zobhedu oluveziweyo nge-Nickel kunye neGolide, ngoko ke iqulathe umaleko ophindwe kabini wesinyithi, i-0.05-0.125 µm (i-intshi ezi-2-5μ) yokuntywiliselwa kweGolide (Au) ngaphezulu kwe-3-6 µm (120- Ii-intshi ezingama-240μ) ye-Nickel engena-electro (Ni) njengoko kubonelelwe kwireferensi yesiqhelo.Ngethuba le nkqubo, i-Nickel ifakwe kwi-palladium-catalyzed surfaces zethusi, ilandelwa yigolide ebambelela kwindawo ye-nickel-plated ngokutshintshiselana kwe-molecular.I-nickel yokugquma ikhusela ubhedu kwi-oxidation kwaye isebenze njengendawo yokuhlangana ye-PCB, kwaye ingumqobo wokuthintela ubhedu kunye negolide ekufudukeleni komnye nomnye, kwaye umaleko obhityileyo kakhulu we-Au ukhusela umaleko we-nickel de inkqubo ye-soldering kwaye ibonelela ngexabiso eliphantsi. ukuchasana noqhagamshelwano kunye nokumanzisa okulungileyo.Obu bunzima buhlala buhambelana kuyo yonke ibhodi yocingo eprintiweyo.Ukudibanisa kwandisa kakhulu ukuchasana nokubola kunye nokubonelela indawo efanelekileyo yokubeka i-SMT.
Inkqubo ibandakanya la manyathelo alandelayo:
1) Ukucoca.
2) I-Micro-etching.
3) Ukudipha kwangaphambili.
4) Ukusebenzisa i-activator.
5) Emva kokudipha.
6) Ukusebenzisa i-nickel engena-electro.
7) Ukusebenzisa igolide yokuntywiliselwa.
Ukuntywiliselwa kwegolide ngokuqhelekileyo kusetyenziswa emva kokuba i-solder imaski isetyenzisiwe, kodwa kwiimeko ezimbalwa, isetyenziswa ngaphambi kwenkqubo yemaski ye-solder.Ngokucacileyo, oku kuya kuzinyusa kakhulu iindleko ukuba lonke ubhedu lugalelwe igolide hayi nje into evezwayo emva kwemaski yesolder.
Lo mzobo ungasentla ubonisa umahluko phakathi kwe-ENIG kunye nezinye izinto ezigqitywe phezulu zegolide.
Ngokobuchwephesha, i-ENIG sesona sisombululo sifanelekileyo se-PCBs ukusukela oko kumila kumbi kweplani kunye ne-homogeneity, ngakumbi i-HDI PCB ene-VFP, i-SMD kunye ne-BGA.I-ENIG ikhethwa kwiimeko apho unyamezelo oluluqilima lufunwayo kwizinto zePCB njengemingxuma ecwecwe kunye netekhnoloji yokucofa.I-ENIG ifanelekile kwakhona kwi-wire (Al) yokudibanisa i-soldering.I-ENIG icetyiswa ngamandla kwiimfuno zeebhodi ezibandakanya iintlobo zokuthambisa kuba iyahambelana neendlela ezahlukeneyo zokuhlanganisa ezifana ne-SMT, iitshiphusi ze-flip, i- Through-Hole soldering, i-wire bonding, kunye neteknoloji yokucofa-fit.I-electroless Ni/Au surface ime kunye nemijikelo ye-thermal emininzi kunye nokuphatha i-tarnish.
I-ENIG ixabisa ngaphezulu kwe-HASL, i-OSP, iSilivere yokuntywila kunye neTin yokuntywiliselwa.Iphedi emnyama okanye iBlack phosphorus pad yenzeka ngamanye amaxesha ngexesha lenkqubo apho ukugcwala kwefosphorous phakathi kwamaleya kubangela udibaniso olungalunganga kunye nemigangatho eyaphukileyo.Enye into embi evelayo ziimpawu zemagneti ezingafunekiyo.
IiPros:
- Umphezulu oFlethi-Ogqwesileyo kwiNdibano yepitch entle (BGA, QFP…)
- Ukuba ne-solderability egqwesileyo
- Ubomi beShelf ende (malunga neenyanga ezili-12)
- Ukuchasana kakuhle koqhagamshelwano
- Igqwesileyo kwiiPCB zobhedu ezishinyeneyo
- Ikhethwa kwi-PTH
- Ilungele iitshiphusi zeflip
- Ifanelekile kwi-Press-fit
- UkuBonda ngocingo (Xa ucingo lweAluminiyam lusetyenziswa)
- I-conductivity yombane egqwesileyo
- Ukuchithwa kakuhle kobushushu
Ububi:
- Iyabiza
- Iphedi ye-phosphorus emnyama
- Ukuphazamiseka kwe-Electromagnetic, ilahleko ebalulekileyo yoMqondiso kwi-high-frequency
- Ayinakuphinda isebenze
- Ayizifanelanga iiPads zoQhagamshelwano lweTouch
Usetyenziso oluxhaphakileyo:
- Izinto ezintsonkothileyo zomphezulu ezifana ne-Ball Grid Arrays (BGAs), i-Quad Flat Packages (QFPs).
- IiPCB ezineMixed Package Technologies, press-fit, PTH, wire bonding.
- PCBs kunye wire bonding.
- Ukusetyenziswa kokuthembeka okuphezulu, umzekelo ii-PCBs kumashishini apho ukuchaneka kunye nokuqina kubalulekile, njenge-aerospace, umkhosi, unyango kunye nabathengi abaphezulu.
Njengomboneleli wezisombululo we-PCB kunye ne-PCBA enamava angaphezulu kweminyaka eli-15, i-PCB ShinTech iyakwazi ukubonelela ngazo zonke iintlobo zokwenziwa kwebhodi ye-PCB enomphezulu oguquguqukayo.Singasebenza nawe ukuphuhlisa i-ENIG, HASL, OSP kunye nezinye iibhodi zeesekethe ezilungiselelwe iimfuno zakho ezithile.Sibonisa ii-PCB ezikhuphisanayo zexabiso lentsimbi engundoqo / i-aluminium kunye nokuqina, ukuguquguquka, ukuguquguquka okuguquguqukayo, kunye nezinto eziqhelekileyo ze-FR-4, i-TG ephezulu okanye ezinye izinto.
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Ixesha lokuposa: Jan-28-2023
