I-Laser Drilling Technology- Kufuneka kwi-HDI PCB Boards Manufacturing
ithunyelwe: Nge-7 kaJulayi, 2022
Iindidi:Iiblogi
Iithegi: PCB, Ukwenziwa kwePCB, I-PCB ephucukileyo, HDI PCB
Microviaszikwabizwa ngokuba yi-blind via-holes (BVHs) ngaphakathiiibhodi zesekethe eziprintiweyo(PCBs) ishishini.Injongo yale mingxuma kukuseka ukudityaniswa kombane phakathi kweeleya kwi-multilayeribhodi yesekethe.Xa izinto zombane ziyilwe nguItekhnoloji yeHDI, iimicrovias azinakuphepheka ziqwalaselwa.Ukukwazi ukubeka okanye ukuvala iipads kunika abaqulunqi ukuguquguquka okukhulu ngokukhetha ukudala indawo yendlela kwiindawo ezixineneyo ze-substrate, ngenxa yoko,iibhodi PCBubungakanani bunokucutheka kakhulu.
Kubenzi be-PCB beebhodi ze-HDI, i-laser drill lolona khetho lufanelekileyo lokomba ii-microvias ezichanekileyo.Ezi microvias zincinci ngobungakanani kwaye zifuna ubunzulu obulawulwayo bokomba.Oku kuchanekileyo kunokuphunyezwa ngokuqhelwa kwe-laser.Ukugrumba ngeLaser yinkqubo esebenzisa amandla elaser agxile kakhulu ekugrumbeni (ukuphunga) umngxuma.Ukugrumba ngeLaser kudala imingxunya echanekileyo kwibhodi yePCB ukuze kuqinisekiswe ukuchaneka naxa ujongana nezona sayizi zincinci.IiLasers zinokugrumba i-2.5 ukuya kwi-3-mil vias kwi-glass flat ebhityileyo yokuqinisa.Kwimeko ye-dielectric engaqiniswanga (ngaphandle kweglasi), kunokwenzeka ukuba uqhube i-1-mil vias usebenzisa i-laser.Ke ngoko, ukugrumba nge-laser kuyacetyiswa ukwenza i-microvias.
Nangona sinokugrumba ngemingxunya ebukhulu obuyi-6 mil (0.15 mm) ngamasuntswana okomba oomatshini, iindleko zezixhobo zonyuka kakhulu njengoko amasuntswana okomba abhityileyo ekhawuleza kakhulu, kwaye efuna ukutshintshwa rhoqo.Xa kuthelekiswa nokugrumba ngoomatshini, izibonelelo zokugrumba iilaser zidweliswe ngezantsi:
- Inkqubo yokungaqhagamshelwa:I-Laser drilling yinkqubo engadibananga ngokupheleleyo kwaye ngoko ke umonakalo owenziwe kwi-drill bit kunye nezinto eziphathekayo ngokuxubha i-vibration kupheliswa.
- Ulawulo oluchanekileyo:Ubukhulu be-boam, ukuphuma kobushushu, kunye nobude be-laser beam ziphantsi kolawulo lweendlela zokomba zelaser, ngaloo ndlela zinceda ukuseka imilo yomngxuma eyahlukeneyo ngokuchaneka okuphezulu.Oku kunyamezelana ± 3 mil njengoko ubuninzi bungaphantsi kunokwembiwa koomatshini kunye nokunyamezela kwe-PTH ± 3 mil kunye ne-NPTH ukunyamezela kwe-± 4 mil.Oku kuvumela ukwakheka kweemfama, ukungcwatywa, kunye ne-vias ezipakishwe xa kusenziwa iibhodi ze-HDI.
- Umyinge wembonakalo ephezulu:Enye yeeparameters ezibalulekileyo zomngxuma owenziweyo kwibhodi yesekethe eprintiweyo yi-aspect ratio.Imele ubunzulu bomngxuma ukuya kwidayamitha yomngxuma we-a via.Ekubeni i-laser inokudala imingxuma ene-diameter encinci kakhulu ngokuqhelekileyo ukusuka kwi-3-6 mil (0.075mm-0.15mm), ibonelela ngomlinganiselo ophezulu.I-Microvia ineprofayile eyahlukileyo xa kuthelekiswa nesiqhelo nge-ayina, ekhokelela kumlinganiselo owahlukileyo.I-microvia eqhelekileyo inomlinganiselo we-0.75:1.
- Isebenza kakuhle emalini:ukugrumba ngelaser kukhawuleza kakhulu kunokwemba oomatshini, naxa kusembiwa i-vias exineneyo ebekwe kwibhodi ye-multilayer.Ngaphezu koko, njengoko ixesha lihamba, iindleko ezongezelelekileyo ezisuka rhoqo ekutshintsheni amasuntswana e-drill aqhekekileyo ayongeza kwaye ukomba ngoomatshini kunokubiza kakhulu xa kuthelekiswa nokomba ngelaser.
- Imisebenzi emininzi:Oomatshini beLaser abasetyenziselwa ukomba banokusetyenziselwa ezinye iinkqubo zokuvelisa ezifana nokuwelda, ukusika, njl.
Abavelisi bePCBube neendlela ezahlukeneyo zokukhetha iilaser.I-PCB ShinTech isebenzisa i-laser ye-infrared kunye ne-ultraviolet wavelength yokomba ngelixa isenza ii-HDI PCB.Ukudityaniswa kwelaser ezahlukeneyo kuyafuneka njengoko abavelisi bePCB basebenzisa izixhobo ezininzi zedielectric njengeresin, prepreg eyongeziweyo, kunye neRCC.
Ubukhulu be-beam, ukuphuma kobushushu, kunye nobude be-laser beam bunokucwangciswa phantsi kweemeko ezahlukeneyo.Imiqadi esebenza kancinci ingagrumba kwizinto eziphilayo kodwa ishiya isinyithi singonakaliswa.Ukusika isinyithi kunye neglasi, sisebenzisa imiqadi ephezulu.Ngelixa imiqadi ephantsi ifuna imiqadi ye-4-14 mil (0.1-0.35 mm) ububanzi, iiplanga eziphakamileyo zifuna imiqadi emalunga ne-1 mil (0.02 mm) ububanzi.
Iqela labavelisi be-PCB ShinTech liqokelele ngaphezulu kweminyaka eyi-15 yobuchwephesha bokusetyenzwa kwe-laser kwaye ibonakalise irekhodi lempumelelo kubonelelo lwe-HDI PCB, ngakumbi kwi-PCB ebhetyebhetye.Izisombululo zethu zenzelwe ukubonelela ngeebhodi zeesekethe ezithembekileyo kunye nenkonzo yobuchwephesha ngexabiso elikhuphisanayo ukuxhasa izimvo zakho zoshishino kwimarike ngempumelelo.
Nceda uthumele umbuzo wakho okanye isicelo sekowuti kuthi aphasales@pcbshintech.comukuqhagamshelwa komnye wabameli bethu bezentengiso abanamava kwishishini ukukunceda ufumane umbono wakho wokuthengisa.
Ukuba unayo nayiphi na imibuzo okanye ufuna ulwazi olongezelelweyo, zive ukhululekile ukusitsalela umnxeba apha+86-13430714229okanyeQhagamshelana nathi on www.pcbshintech.com.
Ixesha lokuposa: Jul-10-2022
