Ukwenza i-HDI PCB kumzi-mveliso we-PCB ozenzekelayo --- ukugqiba umphezulu we-OSP
ithunyelwe:NgoFebruwari 03, 2023
Iindidi: Iiblogi
Iithegi: pcb,pcba,indibano yepcb,ukwenziwa kwepcbpcb umphezulu ukugqiba,HDI
I-OSP imele i-Organic Solderability Preservative, ekwabizwa ngokuba yibhodi yesekethe ukutyabeka kwe-organic ngabavelisi be-PCB, idume ngokugqitywa kweBhodi yeSekethe eShicileleyo ngenxa yeendleko eziphantsi kunye nokusebenziseka ngokulula ukwenza iPCB.
I-OSP isebenzisa ngokwekhemikhali ikhompawundi ephilayo ukuze iveze umaleko wobhedu okwenza iibhondi ezikhethekileyo ngobhedu phambi kokuba zithengiswe, zenza umaleko we-organic metallic ukukhusela ubhedu oluveziweyo kumhlwa.I-OSP Ukutyeba, ibhityile, phakathi kwe-46µin (1.15µm)-52µin(1.3µm), ilinganiswa nge-A° (angstrom).
I-Organic Surface Protectant iyabonakala, ayifane ijongwe.Kwi-soldering elandelayo, iya kususwa ngokukhawuleza.Inkqubo yokuntywiliselwa kwemichiza inokusetyenziswa kuphela emva kokuba zonke ezinye iinkqubo zenziwe, kubandakanywa uvavanyo loMbane kunye noHlolo.Ukufaka umphezulu we-OSP kwi-PCB ngokuqhelekileyo kubandakanya indlela yekhemikhali ehanjiswayo okanye itanki yokudipha eme nkqo.
Inkqubo ngokubanzi ijongeka ngolu hlobo, kunye nezirinse phakathi kwenyathelo ngalinye:
1) Ukucoca.
2) Ukuphuculwa kweTopography: Indawo yobhedu eveziweyo idlula i-micro-etching ukwandisa ibhondi phakathi kwebhodi kunye ne-OSP.
3) I-Acid ihlambulule kwisisombululo se-sulfuric acid.
4) Isicelo se-OSP: Ngeli xesha kwinkqubo, isisombululo se-OSP sisetyenziswa kwi-PCB.
I-5) Ukuhlanjululwa kwe-deionization: Isisombululo se-OSP sifakwe kunye ne-ion ukuvumela ukupheliswa lula ngexesha le-soldering.
6) Yoma: Emva kokuba i-OSP igqityiwe, i-PCB kufuneka yomiswe.
Ukugqitywa komphezulu we-OSP yenye yezona zinto zidumileyo.Lukhetho olunoqoqosho kakhulu, olunobuhlobo nokusingqongileyo kwimveliso yeebhodi zesekethe eziprintiweyo.Inokubonelela ngeepads co-planar umphezulu kwipitches emihle / BGA / ukubekwa amacandelo amancinci.Umphezulu we-OSP unokulungiswa kakhulu, kwaye awufuni ukulungiswa kwezixhobo eziphezulu.
Nangona kunjalo, i-OSP ayomelele njengoko bekulindelekile.Inecala layo.I-OSP inovakalelo ekuphatheni kwaye ifuna ukuphathwa ngokungqongqo ukuphepha imikrwelo.Ngokwesiqhelo, i-soldering ezininzi ayicetyiswa kuba i-soldering ezininzi inokuyonakalisa ifilimu.Ubomi bayo beshelufu bobona bufutshane kuzo zonke izinto ezigqityiweyo.Iibhodi kufuneka zihlanganiswe ngokukhawuleza emva kokufaka isambatho.Ngapha koko, ababoneleli be-PCB banokwandisa ubomi bayo beshelufu ngokuphinda kwenziwe ngokutsha ukugqiba.I-OSP inzima kakhulu ukuyivavanya okanye ukuyihlola ngenxa yobume bayo obungafihliyo.
IiPros:
1) Lead-free
2) Umphezulu osicaba, ulungele iipads ezicolekileyo (BGA, QFP...)
3) Ukwaleka kakhulu
4) Inokusetyenziswa kunye nezinye izinto ezigqityiweyo (umz. OSP+ENIG)
5) Iindleko eziphantsi
6) Ukusebenza kwakhona
7) Inkqubo elula
Ububi:
1) Ayilunganga kwi-PTH
2) Ukuphatha uvakalelo
3) Ubomi obufutshane beShelf (<6 iinyanga)
I-4) Ayifanelekanga iteknoloji ye-crimping
I-5) Ayilunganga ukuhanjiswa kwakhona okuninzi
6) I-Copper iya kubonakaliswa kwindibano, ifuna ukuguquguquka okunamandla
7) Kunzima ukuhlola, kunokubangela imiba kuvavanyo lwe-ICT
Ukusetyenziswa okuqhelekileyo:
I-1) Izixhobo ze-pitch ezicolekileyo: Oku kugqitywa kungcono ukusebenzisa kwizixhobo zokumisa kakuhle ngenxa yokungabikho kweepads ezicwangcisiweyo okanye iindawo ezingalinganiyo.
I-2) Iibhodi zeseva: Ukusetyenziswa kwe-OSP ukusuka kwizicelo ezisezantsi ukuya kwiibhodi zeseva eziphezulu.Olu lwahluko lubanzi ekusebenziseni luyenza ilungele izicelo ezininzi.Ikwasetyenziswa rhoqo ukugqiba okukhethiweyo.
3) Itekhnoloji yokunyuswa komphezulu (SMT): I-OSP isebenza kakuhle kwindibano ye-SMT, xa ufuna ukuncamathisela icandelo ngokuthe ngqo kumphezulu we-PCB.
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Ixesha lokuposa: Feb-02-2023
