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Phantse zonkePCBs kunye neeleya eziphindwe kabini okanye i-multi-layers zisebenzisa i-plaled ngokusebenzisa imingxuma (PTH) ukudibanisa abaqhubi phakathi kweeleya zangaphakathi okanye iileya ezingaphandle, okanye ukubamba amacandelo eentambo zokukhokela.Ukufezekisa oko, iindlela ezilungileyo ezidityanisiweyo ziyafuneka ukuze okwangoku kuqukunjelwe emingxunyeni.Nangona kunjalo, ngaphambi kwenkqubo yokucoca, ngokusebenzisa imingxuma ayi-conductive ngenxa yeebhodi zeesekethe eziprintiweyo zenziwe ngezinto ezingabonakaliyo ze-substrate (i-epoxy-glass, i-phenolic-paper, i-polyester-glass, njl.).Ukuvelisa i-conduciveness nangona iindlela zomngxuma, malunga ne-25 microns (i-1 mil okanye i-0.001 kwi.) yobhedu okanye ngaphezulu echazwe ngumyili webhodi yesekethe kufuneka idiphozithwe ngombane kwiindonga zemingxuma ukudala uxhumano olwaneleyo.

Phambi kokufakwa kobhedu lwe-electrolytical, inyathelo lokuqala kukufakwa kweekhemikhali zobhedu, okwabizwa ngokuba yi-electroless copper deposition, ukufumana umaleko wokuqala wokuqhuba eludongeni lwemingxuma yeebhodi zocingo eziprintiweyo.Ukuncitshiswa kwe-autocatalytic oxidation kwenzeka kumphezulu we-substrate engaqhubiyo ngokusebenzisa imingxunya.Phezu kodonga idyasi ebhityileyo kakhulu yobhedu malunga ne-1-3 ye-micrometer ubukhulu ifakwe ngokwekhemikhali.Injongo yawo kukwenza umphezulu womngxuma uqhube ngokwaneleyo ukuvumela ukwakhiwa ngakumbi ngobhedu oludiphozithwe ngombane kubunzima obuchazwe ngumyili webhodi yocingo.Ngaphandle kobhedu, sinokusebenzisa i-palladium, igraphite, i-polymer, njl.Kodwa ubhedu lolona khetho lungcono kumphuhlisi we-elektroniki kwiimeko eziqhelekileyo.

Njengoko itheyibhile ye-IPC-2221A 4.2 isithi ubuncinci bokutyeba kobhedu obusetyenziswa yindlela yokucwenga ye-electroless copper kwiindonga ze-PTH yokubekwa komndilili wobhedu yi-0.79 mil kwiklasi Ⅰ kunye neClass Ⅱ kunye ne-0.98 mil yeiklasiⅢ.

Umgca wokubekwa kweekhemikhali wobhedu ulawulwa ngokupheleleyo yikhompyutha kwaye iiphaneli zithwalwa ngothotho lweekhemikhali kunye neebhafu zokuhlanjululwa yi-crane ephezulu.Ekuqaleni, iiphaneli ze-pcb ziphathwa kwangaphambili, zisusa yonke intsalela ekubhobhozeni kunye nokubonelela ngoburhabaxa obugqwesileyo kunye nokulunga kwe-electro kukubekwa kweekhemikhali zobhedu.Inyathelo elibalulekileyo yinkqubo ye-permanganate desmear yemingxuma.Ngethuba lenkqubo yokonyango, umgca omncinci we-epoxy resin ugxininiswe kude nomda womgca wangaphakathi kunye neendonga zemingxuma, ukuqinisekisa ukunamathela.Emva koko zonke iindonga zomngxuma zintywiliselwa kwiibhafu ezisebenzayo ukuze zifumane imbewu kunye ne-micro-particles ye-palladium kwiindawo zokuhlambela ezisebenzayo.Ibhafu igcinwa phantsi kokuphazamiseka komoya okuqhelekileyo kwaye iipaneli zihlala zihamba kwindawo yokuhlambela ukususa amaqamza omoya anokuthi enze ngaphakathi kwimingxuma.Umaleko obhityileyo wobhedu ofakwe kuwo wonke umphezulu wephaneli kunye nemingxuma egrunjiweyo emva kokuhlamba i-palladium.Ukufakwa kwe-Electroless plating kunye nokusetyenziswa kwe-palladium kubonelela ngokubambelela ngokuqinileyo kwengubo yobhedu kwi-fiberglass.Ekugqibeleni ukuhlolwa kuqhutyelwa ukujonga i-porosity kunye nobukhulu bengubo yobhedu.

Inyathelo ngalinye libalulekile kwinkqubo iyonke.Nakuphi na ukuphathwa kakubi kwinkqubo kunokubangela ibhetshi yonke yeebhodi zePCB ukuba imoshwe.Kwaye umgangatho wokugqibela wepcb ulele kakhulu kula manyathelo akhankanywe apha.

Ngoku, kunye nemingxuma conductive, uqhagamshelo lombane phakathi umaleko yangaphakathi kunye ngaphandle umaleko esekwe kwiibhodi zesekethe.Inyathelo elilandelayo kukukhulisa ubhedu kuloo mingxunya kunye namaleko aphezulu nasezantsi eebhodi zocingo ukuya kubukhulu obuthile - i-electroplating yobhedu.

Iikhemikhali ezizihambelayo ezipheleleyo zemigca yobhedu yobhedu kwi-PCB ShinTech ene-Cutting edge PTH Technology.

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