Ukwenziwa kwe-HDI PCB kumzi-mveliso we-PCB ozenzekelayo--- ENEPIG PCB umphezulu wokugqiba
ithunyelwe:NgoFebruwari 03, 2023
Iindidi: Iiblogi
Iithegi: pcb,pcba,indibano yepcb,ukwenziwa kwepcbpcb umphezulu ukugqiba,HDI
I-ENEPIG (i-Electroless Nickel Electroless Palladium Immersion Gold) ayisiyonto iqhele ukusetyenziswa kwi-PCB yomphezulu okwangoku ngelixa iye yanda kakhulu kwishishini lemveliso ye-PCB.Isebenza kuluhlu olubanzi lwezicelo umz., iipakethe zomhlaba ezahlukeneyo kunye neebhodi zePCB eziphucuke kakhulu.I-ENEPIG luguqulelo oluhlaziyiweyo lwe-ENIG, kunye nokongeza umaleko wePalladium (0.1-0.5 µm/4 ukuya ku-20 μ'') phakathi kweNickel (3-6 µm/120 – 240 μ'') kunye neGolide (0,02- 0,05 µm/1 ukuya ku-2 μ'') ngenkqubo yokuntywiliselwa kwemichiza kumzi-mveliso we-PCB.I-palladium isebenza njengesithintelo sokukhusela umaleko we-nickel kwi-corrosion ngu-Au, enceda ukuthintela "iphedi emnyama" ukuba ingenzeki nto leyo ingumba omkhulu we-ENIG.
Ukuba akukho bhondiso lohlahlo lwabiwo-mali, i-ENEPIG ibonakala iyinketho engcono kuninzi lweemeko ingakumbi kwiimfuno ezifunwa kakhulu kunye neentlobo ezininzi zepakethe ezifana, ngeemingxuma, i-SMT, i-BGA, i-wire bonding, kunye ne-press fit, xa kuthelekiswa ne-ENIG.
Ngaphezu koko, ukuqina okugqwesileyo kunye nokuchasana kuyenza ihlale ixesha elide.Idyasi ebhityileyo yokuntywiliselwa yenza ukubekwa kwamalungu kunye nokuthambisa kube lula kwaye kuthembekile.Ukongeza, i-ENEPIG ibonelela ngenketho ephezulu ethembekileyo ye-Wire Bonding.
IiPros:
• Kulula ukusetyenzwa
• I-Black Pad Free
• Umphezulu osicaba
• Ubomi beshelufu obugqwesileyo (iinyanga ezili-12+)
• Ukuvumela imijikelo yokubuyisela kwakhona
• Ilungele ukuba iPlated Kwimingxunya
• Inkulu kwiPitch eFine / BGA / iMicimbi emincinci
• Ilungile kuQhagamshelwano loMnxeba / uQhagamshelwano ngokutyhala
• I-Higher Reliability yokuBonding kocingo (igolide/i-aluminiyam) kune-ENIG
• Ukuthembeka kweSolder okunamandla kune-ENIG;Iifom ezithembekileyo ze-Ni / Sn ze-solder
• Iyahambelana kakhulu nee-solders ze-Sn-Ag-Cu
• Uhlolo olulula
Ububi:
• Ayingabo bonke abavelisi abanokubonelela ngayo.
• Ukumanzi kufuneka ixesha elide.
• Iindleko eziphezulu
• Ukusebenza kakuhle kuchatshazelwa ziimeko zeplating
• Isenokungathembeki ngokudityaniswa kocingo lwegolide xa ithelekiswa neSoft Gold
Usetyenziso oluxhaphakileyo:
Iindibano zoXinano oluPhezulu, iiTekhnoloji zePakethe eziNxibeleleyo okanye eziDibeneyo, iZixhobo zokuSebenza eziPhezulu, isicelo sokuBonding ngocingo, ii-PCB ze-IC carrier, njl.
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Ixesha lokuposa: Feb-02-2023
